Model of n-channel or p-channel MOSFET based on surface potential equations.
N-Channel MOSFET
P-Channel MOSFET
Description
The N-Channel MOSFET and P-Channel MOSFET blocks model an n-channel or p-channel field-effect transistor with a metal-oxide-semiconductor (MBD) structure based on surface potential equations.
The block also includes the ability to model thermal effects.
Model based on surface potential equations
The model based on surface potential equations takes into account the following effects:
A fully nonlinear capacitance model (including nonlinear Miller capacitance).
Charge conservation.
Carrier velocity saturation and channel length modulation.
Integrated diode.
Inverse recovery in the embedded diode model.
Influence of temperature on physical parameters.
Dynamic self-heating for the thermal effects modelling option (modelling the effect of self-heating on the electrical characteristics of the device).
This model is a simplified version of the standard PSP model [1], incorporating only some of it in order to find a balance between accuracy and complexity of the model. For more details on the physical assumptions of the phenomena included in this model, see [2].
The following are the surface potential equations for an n-channel MOSFET. The equations for a p-channel MOSFET are derived similarly, but the charges and currents are multiplied by -1.
The model is based on the Poisson equation:
where
- electrostatic potential;
- electron charge;
- concentration of acceptors in the substrate;
- dielectric constant of the semiconductor material (e.g. silicon);
- the difference between the intrinsic Fermi level and the Fermi level of bulk silicon;
- the quasipotential Fermi potential of the surface layer with respect to the bulk layer;
- temperature potential;
- Boltzmann constant;
- temperature.
The Poisson equation is used to derive the surface potential equation:
where
- is the applied gate-substrate voltage;
- is the stress of the flat zone;
- surface potential;
- substrate coefficient:
- specific surface capacitance.
The block uses an explicit approximation of the surface potential equation to avoid the need to numerically solve this implicit equation.
Once the surface potential is known, the drain current is determined as follows
where
- is the width of the device;
- channel length;
- mobility in weak fields;
- velocity saturation;
- surface potential difference between the drain and the source;
and - inversion charge densities at the source and the drain, respectively;
- average inversion charge density along the channel;
- mobility reduction factor. For more information, see the description of the Surface roughness scattering factor parameter;
- channel length modulation:
where
- is the modulation coefficient of the channel length;
- drain-substrate voltage;
- drain-substrate voltage cut to the maximum value corresponding to velocity saturation or cut-off (whichever comes first);
- channel length modulation voltage.
The unit calculates inversion charge densities directly from the surface potential.
The block also calculates nonlinear capacitances from the surface potential. The source and drain charge contributions are assigned using a bias-dependent Ward-Dutton charge separation scheme as described in [3]. These charges are calculated explicitly, so the charges are conserved in this model. Capacitive currents are calculated by taking the time derivatives of the corresponding charges. In practice, the charges within the modelling are normalised to the oxide capacitance and calculated in volts.
The gain of the MOSFET is determined as follows:
The threshold voltage for a shorted source-substrate junction is approximately determined as follows:
where is the surface potential at strong inversion.
In general, the three- and four-channel models consist of an intrinsic MOSFET defined by the surface potential formula, an integrated diode, series resistors, and fixed junction capacitances as shown in the schematic for an n-channel MOSFET.
Modelling an integrated diode
The block simulates an integrated diode with an exponential volt-ampere characteristic (VAC).
The junction capacitance and diffusion capacitance are calculated as:
where
- is the current through the diode;
- is the reverse saturation current;
- drain-substrate voltage;
- ideality factor;
- temperature potential;
- diode junction capacitance;
- junction capacitance at zero bias;
- voltage of the integrated diode;
- diffusion capacitance of the diode;
- transit time.
Modelling of temperature dependence
By default, temperature dependence is not considered and the device is modelled at the temperature for which the parameters are set. To take temperature dependence into account during simulation, set the Parameterization parameter to Model temperature dependence.
The surface potential equation model accounts for the effect of temperature on capacitive characteristics and also simulates the temperature dependence of the static behaviour of the transistor during the simulation.
Parameter Measurement temperature defines temperature , at which some parameters of the device are set. Parameters in the Temperature Dependence section set the modelling temperature and temperature dependence coefficients for other device parameters.
Thermal port
The unit has an optional thermal port hidden by default. To use the H thermal port, select the Enable thermal port checkbox.
Use the thermal port to simulate the effects of generated heat and unit temperature.
The flat zone voltage defines the gate bias that must be applied to achieve a flat zone state on the silicon surface. It is possible to use this parameter to arbitrarily shift the threshold voltage due to differences in material yield performance and trapped charges at the interface or oxide. However, in practice, it is usually recommended to first change the threshold voltage using the Body factor and Surface potential at strong inversion parameters, and use this parameter only for fine tuning.
The value in the drain current equation. Use this parameter when a good linear fit results in too large a saturation current. Increasing the value of this parameter causes the saturation current to decrease. For high voltage devices, it is often the case that good linear mode matching results in too low a saturation current. In this case the gain and the drain ohmic resistance should be increased.
The coefficient , which is the multiplier of the logarithmic term in the equation for . This parameter describes the onset of channel length modulation. For device characteristics that exhibit positive conduction in saturation, increase the value of the parameter to match this behaviour. The value by default is 0, which means channel length modulation is off.
Default value
0.0
Program usage name
modulation_factor
Evaluatable
Yes
#Channel-length modulation voltage —
channel length modulation voltage
V | MV | kV | mV
Details
The voltage in the equation for . This parameter controls the drain voltage at which channel length modulation begins to take effect.
Mobility reduction force. The mobility is equal to , where is the mobility in weak fields without the influence of surface scattering. The mobility reduction factor is defined as , where is the surface roughness scattering coefficient and is the voltage that corresponds to the effective vertical component of the electric field strength in the channel . For high vertical electric fields, electron mobility is approximately proportional to .
Values
1/V | 1/MV | 1/kV | 1/mV
Default value
0.0 1/V
Program usage name
reference_surface_roughness_factor
Evaluatable
Yes
#Linear-to-saturation transition coefficient —
linear region-saturation transition coefficient
Details
This coefficient characterises the smoothness of the transition of the MOSFET characteristic from the linear region to saturation, especially if velocity saturation is enabled. Normally this parameter can be left at its By default value, but you can use it to fine-tune the characteristic curvature -. The expected range of values for this parameter is from 2 to 8.
Default value
8.0
Program usage name
linear_to_saturation_transition_coefficient
Evaluatable
Yes
#Measurement temperature —
measuring temperature
K | degC | degF | degR | deltaK | deltadegC | deltadegF | deltadegR
Details
The temperature , at which the unit parameters are measured. If the value of Device simulation temperature is different from this value, the unit parameters will be determined according to the simulation temperature and reference temperature.
Fixed linear capacitance associated with the gate-to-drain junction.
Values
F | mF | nF | pF | uF
Default value
14.0 pF
Program usage name
C_gd_overlap
Evaluatable
Yes
Body Diode
#Reverse saturation current —
reverse saturation current
A | MA | kA | mA | nA | pA | uA
Details
Current in the equations for the integrated diode.
Set this parameter to a non-zero value to simulate current flow through the integrated diode for applications where the MOSFET current changes sign during simulation, such as when the MOSFET drives an inductive load.
For applications where the MOSFET current never changes sign, such as in a small signal amplifier, set this parameter to 0 to increase the simulation speed.
Values
A | MA | kA | mA | nA | pA | uA
Default value
5.2e-13 A
Program usage name
I_sat_reference
Evaluatable
Yes
#Built-in voltage —
integrated diode voltage
V | MV | kV | mV
Details
The embedded diode voltage in the equations for the embedded diode. This voltage only affects the junction capacitance equation. It does not affect the conduction current.
The ideality factor in the equations for the integrated diode.
Default value
1.0
Program usage name
ideality_factor
Evaluatable
Yes
#Zero-bias junction capacitance —
junction capacitance at zero bias
F | mF | nF | pF | uF
Details
The capacitance between drain and substrate at zero bias due to the integrated diode only, in the equations for the integrated diode.
Values
F | mF | nF | pF | uF
Default value
480.0 pF
Program usage name
C_j0
Evaluatable
Yes
#Transit time —
transit time
d | s | hr | ms | ns | us | min
Details
Time in the equations for the integrated diode.
If the values of the Reverse saturation current and Transit time parameters are non-zero, the block includes reverse recovery in the embedded diode model.
Values
d | s | hr | ms | ns | us | min
Default value
50e-9 s
Program usage name
transit_time
Evaluatable
Yes
Temperature Dependence
#Parameterization —
temperature dependence parameterization
None - Simulate at parameter measurement temperature | Model temperature dependence
Details
Select one of the following methods for parameterising the temperature dependence:
None - Simulate at parameter measurement temperature - the temperature dependence is not simulated. This is the By default method.
Model temperature dependence - Simulate temperature dependent effects. Specify the device modelling temperature value and temperature dependence coefficients for other block parameters.
Values
None - Simulate at parameter measurement temperature | Model temperature dependence
Default value
None - Simulate at parameter measurement temperature
Program usage name
enable_temperature_dependence
Evaluatable
No
#Gain temperature exponent —
degree of temperature dependence of the gain coefficient
Details
The gain of the MOSFET is assumed to be exponentially dependent on temperature: , where is the value of the Gain parameter and is the value of the Gain temperature exponent parameter.
Dependencies
To use this parameter, set the Parameterization parameter to `Model temperature dependence'.
Default value
1.3
Program usage name
gain_temperature_exponent
Evaluatable
Yes
#Flatband voltage temperature coefficient —
coefficient in the temperature dependence of the plane zone stress
V/K
Details
The flatband voltage is assumed to be linearly dependent on temperature: , where is the value of the Flatband voltage parameter and is the value of the Flatband voltage temperature coefficient parameter.
Dependencies
To use this parameter, set the Parameterization parameter to `Model temperature dependence'.
Values
V/K
Default value
5e-4 V/K
Program usage name
flatband_voltage_temperature_coefficient
Evaluatable
Yes
#Surface potential at strong inversion temperature coefficient —
coefficient in the temperature dependence of the surface potential at strong inversion
V/K
Details
The surface potential at strong inversion is assumed to depend linearly on temperature: , where is the value of Surface potential at strong inversion and is the value of Surface potential at strong inversion temperature coefficient.
Dependencies
To use this parameter, set the Parameterization parameter to `Model temperature dependence'.
#Velocity saturation temperature exponent —
degree of temperature dependence of velocity saturation
Details
The velocity saturation is assumed to be exponentially dependent on temperature: , where is the value of the Velocity saturation factor parameter and is the value of the Velocity saturation temperature exponent parameter.
Dependencies
To use this parameter, set the Parameterization parameter to `Model temperature dependence'.
Default value
1.04
Program usage name
velocity_saturation_temperature_exponent
Evaluatable
Yes
#Surface roughness scattering temperature exponent —
degree index of temperature dependence of surface roughness scattering coefficient
Details
This parameter leads to a temperature-dependent decrease in the conductivity of the MOSFET at high gate voltage.
The surface roughness scattering factor is assumed to depend exponentially on temperature: , where is the value of the Surface roughness scattering factor and is the value of the Surface roughness scattering temperature exponent.
Dependencies
To use this parameter, set the Parameterization parameter to `Model temperature dependence'.
Default value
0.65
Program usage name
surface_roughness_temperature_exponent
Evaluatable
Yes
#Resistance temperature exponent —
temperature dependence of resistance
Details
Series resistances are assumed to correspond to semiconductor resistances. Therefore, they decrease exponentially with increasing temperature: , where is , or for source, drain or gate resistance, respectively, is the value of the corresponding Source ohmic resistance, Drain ohmic resistance or Gate ohmic resistance parameter, and is the value of the Resistance temperature exponent parameter.
Dependencies
To use this parameter, set the Parameterization parameter to Model temperature dependence.
Default value
0.95
Program usage name
resistance_temperature_exponent
Evaluatable
Yes
#Body diode reverse saturation current temperature exponent —
degree of temperature dependence of the reverse saturation current
Details
The inverse saturation current for an integrated diode is assumed to be proportional to the square of the concentration of intrinsic carriers: , where is the temperature-dependent effective density of states and is the temperature-dependent bandgap width for the semiconductor material. In order not to introduce another parameter for the temperature dependence, the temperature dependence of the forbidden zone width is neglected in the block and the forbidden zone width of silicon at 300 K (1.12 eV) is used for all types of devices. Thus, the temperature dependence of the reverse saturation current is defined as follows:
Where is the value of the Reverse saturation current parameter, is the Boltzmann constant, is the value of the Body diode reverse saturation current temperature exponent parameter. The value by default is 3 since for silicon is roughly proportional to . It is possible to account for the temperature dependence of the forbidden band width by adjusting the value of .
Dependencies
To use this parameter, set the Parameterization parameter to Model temperature dependence.
Default value
3.0
Program usage name
reverse_saturation_current_temperature_exponent
Evaluatable
Yes
#Device simulation temperature —
device modelling temperature
K | degC | degF | degR | deltaK | deltadegC | deltadegF | deltadegR
Details
Temperature , for which the device simulation is performed.
Dependencies
To use this parameter, set the Parameterization parameter to Model temperature dependence.
To enable thermal effects modelling, select the check box for this parameter.
Default value
false (switched off)
Program usage name
has_thermal_port
Evaluatable
No
#Thermal network —
selection of an internal thermal model
Specify junction and case thermal parameters | Cauer model | Cauer model parameterized with Foster coefficients | External
Details
Select the internal thermal model:
Specify junction and case thermal parameters;
Cauer model;
`Cauer model parameterized with Foster coefficients';
External.
Values
Specify junction and case thermal parameters | Cauer model | Cauer model parameterized with Foster coefficients | External
The [R_JC R_CA] vector of two values of thermal resistance. The first value, R_JC, is the thermal resistance between the junction and the chassis. The second value, R_CA is the thermal resistance between the H port and the device enclosure.
Dependencies
To use this parameter, set the Thermal network parameter to Specify junction and case thermal parameters.
Values
K/W
Default value
[0.0, 10.0] K/W
Program usage name
thermal_resistance_vector
Evaluatable
Yes
#Thermal resistances, [R1 R2 ... Rn] —
vector of thermal resistances for the Kauer model
K/W
Details
A vector of values of the thermal resistances represented by the Kauer elements in the thermal network. All these values must be greater than zero.
Dependencies
To use this parameter, set the Thermal network parameter to Cauer model.
Values
K/W
Default value
[1.0, 3.0, 10.0] K/W
Program usage name
thermal_resistance_cauer_vector
Evaluatable
Yes
#Thermal resistances, [R1 R2 ... Rn] —
vector of thermal resistances for the Foster model
K/W
Details
A vector of values of thermal resistances represented by the Foster model coefficients in the heat network. All these values must be greater than zero.
Dependencies
To use this parameter, set the Thermal network parameter to `Cauer model parameterised with Foster coefficients'.
Values
K/W
Default value
[4.0, 6.0] K/W
Program usage name
thermal_resistance_foster_vector
Evaluatable
Yes
#Thermal mass parameterization —
heat capacity parameterization
By thermal time constants | By thermal mass
Details
Select the method for specifying the heat capacity:
By thermal time constants - parameterise the heat capacity in terms of thermal time constants. This value is used by default.
By thermal mass - parameterization of heat capacity values.
Dependencies
To use this parameter, set the Thermal network parameter to Specify junction and case thermal parameters, Cauer model or Cauer model parameterised with Foster coefficients.
Values
By thermal time constants | By thermal mass
Default value
By thermal time constants
Program usage name
thermal_mass_parameterization
Evaluatable
No
#Junction and case thermal masses, [M_J M_C] —
vector of heat capacity values for the Cowhert model
J/K | kJ/K
Details
The vector [M_J M_C] of two heat capacity values. The first value M_J is the heat capacity of the transition. The second value, M_C, is the heat capacity of the case.
Dependencies
To use this parameter, set the Thermal network parameter to `Specify junction and case thermal parameters' and the Thermal mass parameterization parameter to `By thermal mass'.
Values
J/K | kJ/K
Default value
[0.0, 1.0] J/K
Program usage name
thermal_mass_vector
Evaluatable
Yes
#Thermal masses, [M1 M2 ... Mn] —
vector of heat capacity values for the Kauer model
J/K | kJ/K
Details
A vector of heat capacity values, where is the number of Kauer model coefficients in the heat network. All these values must be greater than zero.
Dependencies
To use this parameter, set the Thermal network parameter to `Cauer model' and the Thermal mass parameterization parameter to `By thermal mass'.
Values
J/K | kJ/K
Default value
[0.1, 0.3, 1.0] J/K
Program usage name
thermal_mass_cauer_vector
Evaluatable
Yes
#Thermal masses, [M1 M2 ... Mn] —
vector of heat capacity values for the Foster model
J/K | kJ/K
Details
A vector of heat capacity values, where is the number of Foster elements in the heat network. All these values must be greater than zero.
Dependencies
To use this parameter, set the Thermal network parameter to `Cauer model parameterised with Foster coefficients' and the Thermal mass parameterization parameter to `By thermal mass'.
Values
J/K | kJ/K
Default value
[1.5, 3.0] J/K
Program usage name
thermal_mass_foster_vector
Evaluatable
Yes
#Junction and case thermal time constants, [t_J t_C] —
vector of thermal time constants
d | s | hr | ms | ns | us | min
Details
A vector [t_J t_C] of two values of thermal time constants. The first value, t_J, is the thermal time constant of the transition. The second value, t_C is the thermal time constant of the body.
Dependencies
To use this parameter, set the Thermal network parameter to Specify junction and case thermal parameters and the Thermal mass parameterization parameter to By thermal time constants.
Values
d | s | hr | ms | ns | us | min
Default value
[0.0, 10.0] s
Program usage name
thermal_time_constant_vector
Evaluatable
Yes
#Thermal time constants, [t1 t2 ... tn] —
vector of thermal time constants for the Kauer model
d | s | hr | ms | ns | us | min
Details
A vector of values of thermal time constants, where is the number of Kauer elements in the thermal network. All these values must be greater than zero.
The heat capacity value is calculated as , where , and are the heat capacity, thermal time constant and thermal resistance for the -th Cauer element.
Dependencies
To use this parameter, set the Thermal network parameter to `Cauer model' and the Thermal mass parameterization parameter to `By thermal time constants'.
Values
d | s | hr | ms | ns | us | min
Default value
[1.0, 3.0, 10.0] s
Program usage name
thermal_time_constant_cauer_vector
Evaluatable
Yes
#Thermal time constants, [t1 t2 ... tn] —
vector of thermal time constants for the Foster model
d | s | hr | ms | ns | us | min
Details
A vector of values of thermal time constants, where is the number of Foster model coefficients in the thermal network. All these values must be greater than zero.
The heat capacity value is calculated as , where , and are the heat capacity, thermal time constant and thermal resistance for the -th Cauer element.
Dependencies
To use this parameter, set the Thermal network parameter to `Cauer model parameterised with Foster coefficients' and the Thermal mass parameterization parameter to `By thermal time constants'.
Values
d | s | hr | ms | ns | us | min
Default value
[6.0, 18.0] s
Program usage name
thermal_time_constant_foster_vector
Evaluatable
Yes
#Junction and case initial temperatures, [T_J T_C] —
initial temperature vector
K | degC | degF | degR | deltaK | deltadegC | deltadegF | deltadegR
Details
Vector [T_J T_C] of two temperature values. The first value, T_J, is the initial transition temperature. The second value, T_C is the initial case temperature.
Dependencies
To use this parameter, set the Thermal network parameter to Specify junction and case thermal parameters.
[1] Gildenblat, G., et al. "Introduction to PSP MOSFET model." Proc. the MSM 2005 Int. Conf., Nanotech 2005. 2005.
[2] Van Langevelde, R., A. J. Scholten, and D. B. M. M. Klaassen. "Physical Background of MOS Model 11. Level 1101." Nat.Lab. Unclassified Report 2003/00239. April 2003.
[3] Oh, S-Y., D. E. Ward, and R. W. Dutton. "Transient analysis of MOS transistors." IEEE J. Solid State Circuits. SC-15, pp. 636-643, 1980.